AL₂O₃ Ceramic PCB: High-Performance Double-Sided Substrates for IGBT Heat Dissipation

(Note: PCBs are custom-made products; images and specifications provided are for reference only.)

Brief Introduction

The AL₂O₃ (96%) ceramic PCB is crafted from high-quality ceramic material, providing excellent thermal conductivity, insulation, and mechanical strength. This double-sided PCB features a 1mm dielectric thickness and is designed with 1oz copper on both sides to ensure superior conductivity and signal transmission. The board is free of solder masks and silkscreen characters, and its surface is coated with 2 micro-inches of immersion gold, enhancing solderability, oxidation resistance, and corrosion resistance. This PCB is ideal for electronic devices requiring high power, high frequency, and high reliability.

Basic Specifications

Board Dimensions: 98mm x 98mm (1 piece, +/- 0.15mm)
Minimum Trace/Space: 6/6 mils
Minimum Hole Size: 0.3mm
Blind Vias: None
Finished Board Thickness: 1.1mm
Finished Copper Weight: 1oz (1.4 mils) on outer layers
Via Plating Thickness: 20 μm
Surface Finish: Immersion Gold
Top Silkscreen: No
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
Electrical Testing: 100% electrical test prior to shipment

PCB Specifications

Introduction of Al₂O₃ 96% Ceramic Material

The 96% purity alumina ceramic copper-clad laminate serves as a high-performance electronic substrate. It consists of a 96% alumina (Al₂O₃) ceramic substrate laminated with a high-purity copper layer. The ceramic substrate is manufactured through precision sintering, while the copper layer is securely bonded using Direct Bonded Copper (DBC) or Active Metal Brazing (AMB) technology, ensuring both structural stability and functional performance.

Characteristics

High Thermal Conductivity: Approximately 24 - 28 W/(m·K), effectively dissipating heat from high-power devices.
Excellent Insulation: High resistivity (>10¹⁴ Ω·cm) and a breakdown voltage of 15 - 20 kV/mm for circuit safety.
Thermal Expansion Matching: Coefficient of thermal expansion similar to silicon chips (~7.1×10⁻⁶/℃), reducing thermal stress failure risks.
High Mechanical Strength: Flexural strength ≥300 MPa, capable of withstanding high temperatures (long-term operating temperature >800℃).
Cost-effectiveness: Lower raw material costs compared to 99% high-purity alumina while maintaining performance, making it suitable for large-scale applications.

Core Processes

Surface Metallization: Utilizes DBC or AMB processes to bond copper to the alumina substrate.
Precision Pattern Formation: Employs lithography and etching techniques to create micro-circuits for high-density packaging.

Application Fields

Power Electronics: Ideal for IGBT modules, electric vehicle motor controllers, and photovoltaic inverters, effectively carrying high currents and dissipating heat.
LED Lighting: Functions as a COB (Chip-on-Board) substrate, enhancing heat dissipation efficiency and extending the lifespan of high-power LEDs.
RF/Microwave Devices: Suitable for high-frequency circuits in 5G communication base stations and radar systems, ensuring signal integrity with low dielectric loss (tanδ < 0.001).
Aerospace: Its high-temperature and radiation resistance characteristics make it suitable for satellite power systems and avionics equipment.

Comparison and Advantages

Compared to aluminum nitride (AlN) or silicon nitride (Si₃N₄) substrates, the 96% alumina copper-clad laminate offers better cost efficiency and process maturity. Its heat resistance and thermal conductivity significantly exceed those of epoxy-resin-based PCBs, making it ideal for applications with power densities greater than 100 W/cm².

Development Trends

As electronic devices become more compact and powerful, this material is evolving towards ultra-thin types (substrate thickness <0.2 mm), multi-layer structures, and 3D integration. Its thermo-mechanical properties are being optimized through doping modifications, expanding its applications in emerging fields like new energy and smart grids.

Data Sheets

Our PCB Processing Capability

We specialize in processing precision circuits with line widths/spaces of 3mil/3mil and conductor thicknesses from 0.5oz to 14oz. Our capabilities include micro-via filling, inorganic dam processes, and 3D circuit fabrication. We handle various processing thicknesses, including 0.25mm, 0.38mm, 0.5mm, 0.635mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm, and 3.0mm. Additionally, we offer a range of surface treatments, including electroplated gold, electroless nickel palladium immersion gold, electroplated silver, electroplated nickel, and immersion tin processes.